10cc Lead-free Solder Flux RMA-223 for Chips Computer Phone LED for BGA SMD PGA Repair Tool Scaling Powder DIY

Features: brand new and high quality Rma-223 is a moderate active rosin solder paste, which is widely used in SMD repair process of mobile phone board. It is a non washable solder paste with very light residue color and high SIR value. It is recommended to be used for repairing BGA, CSP and other ball array solder joints. Good immersion and high strength joint, non-toxic and non corrosive. Good insulation and smooth welding surface, no deterioration, no drying. It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue.

Specifications: Material: Scaling Powder Length: 9.5cm/3.74inches

Package Includes: 1 Set Lead-free Solder Flux

note: There may be an error of 0.1-1 mm when measuring the product.